HDI (High Density Interconnect PCB) is commonly used in applications such as smartphones, tablets, wearable devices, medical equipment, aerospace systems, and automotive electronics. C-Alley has specialized in providing customers with advanced HDI PCB design and manufacturing techniques and high quality products.

HDI PCB (High Density Interconnect PCB) contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today’s large pin-count chips utilized in mobile devices and other high technology products.
HDI Structures: 1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers; i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers.

Key features of HDI PCB include:

High density: HDI PCBs use smaller vias and microvias, allowing for increased circuit density and reduced size. This enables the placement of more components in a smaller area.

Miniaturization: HDI PCBs allow for the use of smaller and more tightly packed components, resulting in smaller and lighter electronic devices.

High-speed performance: The shorter trace lengths and reduced signal interference in HDI PCBs enable better signal integrity, making them suitable for high-speed and high-frequency applications.

Multiple layers: HDI PCBs often have multiple layers, including stacked vias and buried vias, which provide additional routing options and increased design flexibility.

Improved thermal management: HDI PCBs can incorporate thermal vias and copper-filled microvias to enhance heat dissipation and thermal management in compact designs.