Hybrid Laminates PCB(or called multi-layer hybrid PCB) is charactered as having different isolation material are used between layers of the circuits.
This allows the choice of material to be tailored the different functions on the different layers of the PCB board.As the different dielectrics have different thermal conductivity,mechanical stress,frequency and dielectric constant,PCB designers can expect different performance by using different dielectrics between layers of the circuit.
Layers: 4L
Thickness: 1.6mm
Min Hole Size: 0.15mm
Min Line Width: 0.1mm
Copper Thickness: 1oz
Surface Finishing: ENIG
Molding Tolerance:+/-0.05mm
Layers: 4L
Thickness: 1.2mm
Min Hole Size: 0.15mm
Min Line Width: 0.15mm
Copper Thickness: 1oz
Surface Finishing: ENIG
Molding Tolerance:+/-0.05mm
Layers: 4L
Thickness: 1.6mm
Max Length: 1265mm
Min Line Width: 0.1mm
Copper Thickness: 1oz
Surface Finishing: ENIG
Molding Tolerance:+/-0.05mm
Layers: 4L
Thickness: 1.8mm
Min Hole Size: 0.15mm
Min Line Width: 0.1mm
Copper Thickness: 1oz
Surface Finishing: ENIG
Molding Tolerance: +/-0.05mm
Hybrid Laminates PCB Production Capability
Item | Standard | Advanced |
Layer Count | 1-12L | 1-16L |
Max.PanelSize | 2L:250mm×540mm | 2L:250mm×540mm |
Min.Finished Board Thickness | 2L:0.20mm | 2L:0.20mm |
Min.Trace Width | 0.076mm | 0.076mm |
Min. Drill Size | 0.15mm | 0.15mm |
Min. Laser Drill Size | 0.075mm | 0.075mm |
Min.Cu Thickness | 12um | 12um |
Molding Tolerance | +/-0.05mm | +/-0.05mm |