FUJI XPF-L Modules SMT Machines
FUJI NXT-II Modules SMT Machines
HITACHI Screen Printer
Reflow Oven
SMT Lines
SMT Lines
For IC & BGA Storage
PCB Baking Oven
Solder Paste Storage
BGA Rework Machine
X-Ray
AOI
3D SPI (Soder paste testing inspection)
Wave Sodering
HITACHI Screen Printer
• High precision, speed and stability
• High identification position system
Applicable to the production
• PCB Size(LxW)mm
Min 50×50~Max 330×250
PCB Thickness:0.4 ~3.0mm
Stencil size(LxW)mm: 650×550
FUJI XPF-L Mounting
FUJI NXT II Mounting
High precision, speed and stability
High recognized position system
Daily production capacity can reach 1.05 million points
Be applicable to the production:
PCB Size(LxW)mm
Min 48×48~Max 534×510
PCB Thickness:0.4 ~3.0mm
Specifications for SMT components:
QFP, TQFP, BGA, QFN PLCC, SOT, SOIC
(Pitch 0.3mm)
1005、0201、0603、0402
3216、 2125、 1608、