HDI PCB

HDI (High-Density Interconnect PCB) is commonly used in applications such as smartphones, tablets, wearable devices, medical equipment, aerospace systems, and automotive electronics. C-Alley has specialized in providing customers with advanced HDI PCB design and manufacturing techniques and high-quality products.

HDI PCB (High-Density Interconnect PCB) contains blind and/or buried vias and often contains micro vias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines, and high-performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper-filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today’s large pin-count chips utilized in mobile devices and other high-technology products.
HDI Structures: 1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers; i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high-density interconnection layers.

Key features of HDI PCB include:

High density: HDI PCBs use smaller vias and micro vias, allowing for increased circuit density and reduced size. This enables the placement of more components in a smaller area.

Miniaturization: HDI PCBs allow for the use of smaller and more tightly packed components, resulting in smaller and lighter electronic devices.

High-speed performance: The shorter trace lengths and reduced signal interference in HDI PCBs enable better signal integrity, making them suitable for high-speed and high-frequency applications.

Multiple layers: HDI PCBs often have multiple layers, including stacked vias and buried vias, which provide additional routing options and increased design flexibility.

Improved thermal management: HDI PCBs can incorporate thermal vias and copper-filled micro vias to enhance heat dissipation and thermal management in compact designs.