Multi-layer PCB

We have trusted experts in multilayer PCB design and manufacturing. With our expertise and advanced capabilities catering to a wide range of industries and applications.

Our design services include:

• Schematic capture and layout design
• Signal integrity analysis
• Component selection and BOM optimization
• Design for manufacturing ability (DFM) and design for test ability (DFT)
• Thermal management solutions
• High-speed and impedance-controlled design
• Manufacturing Capabilities
• We boast state-of-the-art manufacturing facilities equipped with advanced equipment and technologies to ensure the highest quality and precision
• In multilayer PCB fabrication. Our manufacturing processes adhere to industry standards and undergo rigorous quality control measures at every stage.

Key features of our manufacturing capabilities:

• Multilayer PCB fabrication up to 60 layers
• Advanced material options, including FR-4, high-frequency and specialized substrates
• Controlled impedance and high-speed design support
• Blind and buried vias, via-in-pad, and micro-via technology
• Fine-pitch component assembly and advanced soldering techniques
• ROHS compliant and lead-free manufacturing options
• Comprehensive testing and inspection, including electrical testing, AOI, and X-ray inspection