C-Alley BGA Assembly is a technology used in the manufacture of electronic products. BGA (Ball Grid Array) is a surface mount technology commonly used in the installation of integrated circuits (ics) and other electronic components. During BGA assembly, the pins of the electronic components are connected to a spherical solder joint grid on the printed circuit board (PCB) to provide a reliable electrical connection.
C-Alley BGA Assembly provides efficient and accurate BGA component assembly services. This assembly process involves several steps, including PCB preparation, spherical solder joint coating, component positioning, hot air welding, and testing. The professional team at C-Alley BGA Assembly has the experience and know-how to ensure the high quality and reliability of the assembly process.
By choosing C-Alley BGA Assembly, you can enjoy the following advantages:
- High quality and reliability
- Precise component positioning
- Fast delivery
- Technical Support and solutions
BGA PCB Assembly with X Ray Inspection
C-Alley has started build (Ball Grid Array) BGA assembly service experience since Year 2005 to present time. Over these many years experience with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA board.
Ball grid array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA unfilled die attachment technology will result in a smaller profile, lighter weight, thinner thickness, less interference, minimal signal delay, optimal electrical performance and improve its thermal property greatly. Therefore, BGA has been commonly used for its better assembly capability and high reliability.
Stringent BGA PCB Assembly Testing Process
To achieve the highest quality standards for BGA assembly, we use a variety of inspection methods throughout the process including optical inspection, mechanical inspection, and X-ray inspection. Among them, the inspection of BGA solder joints must use X-rays. X-rays can pass through the components to inspect the solder joints below them, so as to check the solder joint position, solder joint radius, and solder joint thickness.
Efficient Use of Space – BGA PCB layout allows us to efficiently use the available space, so we can mount more components and manufacture lighter devices.
Better Thermal Performance – For BGA, the heat generated by the components is transferred directly through the ball. In addition, the large contact area improves heat dissipation, which prevents overheating of components and ensures long life.
Higher Electrical Conductivity – The path between the die and the circuit board is short, which results in better electrical conductivity. Moreover, there is no through-hole on the board, the whole circuit board is covered with solder balls and other components, so vacant spaces are reduced.
Easy to Assemble And Manage – Compared to other PCB assembly techniques, BGA is easier to assemble and manage as the solder balls are used directly to solder the package to the board.
Less Damage to Leads – We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during the operation.
BGA PCB Assembly Capacities at C-alley Technology
| BGA Types: | µBGA, CTBGA, CABGA, CVBGA, VFBGA, LGA,etc |
| Number of Layers: | Up to 40 layers |
| Solder balls: | Lead & lead-free |
| Pitch Size: | Minimum pitch sizes 0.4mm placement accuracy +/- 0.03 mm |
| Passive Footprints: | 0201, 01005, POP, 0603, and 0402 |
| BGA Assembly Size: | 1x1mm to 50x50mm |
| Board Thickness: | 0.2mm-7mm |
| Certifications: | ISO9001, IS014001, ISO13485, RoHS, IPC, etc. |
C-Alley deserves to be your long-term partner
Quality Assurance
- We fully comply with the ISO quality management system and all processes meet the highest quality standards for BGA PCB assembly.
Strong Assembly Capacities
- C-alley is capable of handling almost all types of BGA, assembling BGA components from small to large sizes, including fine pitch BGA.
In-depth Expertise
- We have a BGA assembly team composed of professional engineers and IPC-trained employees, providing technical support throughout the process to ensure high reliability.
