EMC-SI-PI Analysis

With the continuous improvement of the operating speed of electronic devices, designed to connect the interconnection system equipment, circuit boards, integrated circuits and devices is increasingly becoming the key to the success of the overall system design constraints, high-speed high-density PCB design, its signal integrity (SI) problem, power integrity (PI) and electromagnetic compatibility problems (EMC / EMI) has become a core issue which must be addressed in the project design.