Kingsheng’s PCB assembly service includes both surface mount technology (SMT) and through-hole technology (THT) assembly, as well as mixed technology assembly. They are capable of handling single and double-sided PCBs, as well as multilayer PCBs with up to 60 layers. 15 SMT lines in total are equipped with production and inspection devices that ensure the yield and efficiency of PCB Assembly.
SMT PCB Assembly Capabilities
| Item | Capability | |
| 1 | Single and double-sided SMT/PTH | Yes |
| 2 | Large parts on both sides, BGA on both sides | Yes |
| 3 | Smallest Chips size | 01005 |
| 4 | BGA type | QFP QFN LGA CGA BGA PGA |
| 5 | Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| 6 | Max process board size (mounting) | 700mm*460mm |
| 7 | Min process board size (mounting) | 50mm*50mm |
| 10 | Process type | Any(Flexible,rigid-flex,HDI,Aluminum substrate) |
| 8 | Variable active and positive components Metal/Enclosure/Housing parts Cable/wire/socket | Yes |
| 9 | Wave soldering, conformal coating, Ultrasonic PCBA Cleaning | Yes |
| 11 | Panelized PCB | 1． Tab routed 2． Breakaway tabs 3． V-Scored 4．Routed+ V scored |
| 12 | Inspection | 3D SPI&3D AOI, X-RAY |
| 13 | Test Capability | Flying Probe Test, ICT, Functional test |
| 14 | Reliability Test | YES( aging, humidity test, high and low temp, etc. ) |
| 15 | Rework | 1． BGA removal and replacement station 2． SMT IR rework station 3． Thru-hole rework station |
| 16 | Followed IPC Standard | IPC-A-610 Class Ⅱ, Class Ⅲ |
