C-Alley offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillary action is beneficial in that it “stays where you put it” which helps prevent solder getting into enclosures and other exclusion areas.
Our conventional solder joining assembly services supplement our flux free S-Bond bonding services and are offered when S-Bond joining is not suitable or more costly.
Our engineering and manufacturing staff has the expertise and experience to solder assemble your components using either conventional soldering methods or S-Bond solder, depending on the application.