HDI PCB,PCB Fabrication

PCB Manufacturing Capabilities –advanced PCB Fabrication Equipments.

With over 10 years productin experience in PCB manufacturing , from Prototyping to finished board with components, also Box build assembly.

Welcome to send us an quote :  sales5@c-alley.com

Your inquiry will be replied within 24 Hrs .

HDI technology including Rigid and Flex-Rigid Printed Circuit Boards with blind vias, buried vias, blind micro-vias, copper filled micro-vias, resin filled vias, stacked vias, sequential build-up, buried resistance and buried capacitance.

  • PCB Layout, CAD, Design for Manufacturability and Cost (DFx)
  • Quick-turn PCB Prototyping for High Technology PCBs, Circuits
  • High-volume, 100% electronical testing
  • Advanced Technology: Latest Laminates, HDI, any Layer Via Structures, Multiple Sequential Laminations
SPECIFICATIONS STANDARD         HIGH-TECH NEXT STEP
Base Material Used FR4 – FR4 HiTg° BT Epoxy – Polyimide -Teflon – INVAR – Halogen Free – Hi Frequence BT Epoxy – Polyimide -Teflon – INVAR – Halogen Free – Hi Frequence
PCB Type Rigid Rigid – Rigid – Rigid/Flex (hybrid) Rigid – Rigid – Rigid/Flex
(hybrid) (Teflon+Kapton)
Maximum Number of Layers 16 36 – 32 – 24 40 – 40 – 32
Maximum Board Dimension 570 x 449 640×570 mm
Maximum Board Thickness 3.2 mm 6.5 mm
Minimum core Thickness 0.1 mm 0.05 mm – 0.025 (Flex)
Base Copper Thickness 18 – 35 – 70 µ 9-12-18-35-70-105-140-210-305 µ
Aspect Ratio 8:1 24:1 30:1
Minimum Diameter Hole (Mechanical) 0.2 mm 0.15 mm 0.1 mm
Minimum Diameter Hole (Laser) 100 µ 75 µ 60 µ
Nickel Thickness on the Connector > 4 µ > 4 µ
Gold Thickness on the Connector > 0.8 µ > 0.8 µ
Holes Position Tolerance ± 0.1 mm
(from the board edge)
± 0.07 mm on PCB with diagonal
< 300 mm (from the board edge)
Minimum Trace 100 µ 75 µ 50 µ
Minimum Space 100 µ 75 µ 50 µ
Plated Hole Tolerance -0.05 ÷ + 0.1 mm -0.05 ÷ + 0.05 mm
Unplated Hole Tolerance 0 ÷ + 0.1 mm 0 ÷ + 0.1 mm
Conformity Certificate On demand On demand
Test Certificate On all delivery On all delivery
Controlled Impedance Certification On demand On demand
Production Date (week and year) On solder mask On copper (on demand) On solder mask On copper (on demand)
Certification UNI EN ISO 9001:2008 – ISO TS 16949-2002 UL Certified: 94V-0 up to 130° UNI EN ISO 9001:2008 – CNES – AS9100B EN9100:2003/S1 – JISQ9100:2004 UL Certified:
94V-0 up to 130°
ISO 14000
Routing Tolerance ± 0.2 mm ± 0.15 mm
Surface Finishes H.A.S.L. – Lead Free H.A.S.L.
Electroless Gold
Electroless Tin – OSP
Electrolytic Ni – Electrolytic NiAu
Solder Mask Types Photographic Photographic
Legend White Different Colours
Electrical Test (short and open) 100.% 100.%