BGA (Ball Grid Array) Assembly with X Ray Inspection
C-Alley has started build (Ball Grid Array) BGA assembly service experience since Year 2005 to present time. Over these many years experience with X Ray inspection machine, right assembly procedure, we are very confident to say that we know, and we can build a high quality, good yield rate BGA board.
Ball grid array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module. BGA unfilled die attachment technology will result in a smaller profile, lighter weight, thinner thickness, less interference, minimal signal delay, optimal electrical performance and improve its thermal property greatly. Therefore, BGA has been commonly used for its better assembly capability and high reliability.